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E-mail Message: I thought you might be interested in this item at http://pcc.worldcat.org/oclc/557051537 Title: Advanced MEMS packaging Author: John H Lau Publisher: New York : McGraw-Hill, ©2010. ISBN/ISSN: 9781615831593 1615831592 9780071626231 0071626239 9780071627924 0071627928 9780071741835 0071741836 OCLC:557051537

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Advanced MEMS packaging

Author:	John H Lau; et al
Publisher:	New York : McGraw-Hill, ©2010.
Edition/Format:	eBook : Document : EnglishView all editions and formats
Summary:	This book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging.

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Genre/Form:	Electronic books
Additional Physical Format:	Print version: Advanced MEMS packaging. New York : McGraw-Hill, c2010 (DLC) 2009040456 (OCoLC)277205716
Material Type:	Document, Internet resource
Document Type:	Internet Resource, Computer File
All Authors / Contributors:	John H Lau; et al Find more information about:
ISBN:	9781615831593 1615831592 9780071626231 0071626239 9780071627924 0071627928 9780071741835 0071741836
OCLC Number:	557051537
Description:	1 online resource (xxiii, 552 p.) : ill.
Contents:	Introduction to MEMS -- Advanced MEMS packaging -- Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices.
Other Titles:	Advanced microelectromechanical systems packaging
Responsibility:	John H. Lau ... [et al.].
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